Innovative COoling system for embedded Power Electronics


PROJECT ICOPE: Innovative COoling system for embedded Power Electronics

TOPIC: JTI-CS2-2016-CFP04-SYS-02-25

The next generation of power electronic module needs to be highly integrated to reduce the weight impact for the more electrical aircraft. If new technologies of power components such as SiC and GAN support higher temperature environment, these power components need to be cooled to maintain reliable operating temperatures. The challenge is to develop effective heat sinks that serve for extracting and transferring the dissipated power from the power semiconductors with removal of heat by means of air flow through the heat sink. For this application, the partner shall combine material with high thermal conductivity properties and optimized folded brazed fin heat sink solution. The evaluation of heat sink prototypes is expected as a stand-alone effort and also in a mechanical structure to represent a power management system integrating a few electronic modules equipped with the high efficiency heat sink technology.


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This project has received funding from the Clean Sky 2 Joint Undertaking under the European Union's Horizon 2020 research and innovation programme under grant agreement No 755556